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Thermal Pad

A silicon-based thermal pad product with high thermal conductivity properties ranging from 3W/mK to 6W/mK. It has high dispersion, thickness, and heat dissipation uniformity.
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Product Details

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Thermal Pad
No. Category Unit Properties Evaluation method
Measurement conditions Model : VSP-01
1 Hardness - Shore 00 40 ~ 60 ± 10 ASTM D2240
2 Density g/㎤ 25℃ 2.9 ± 0.1 ASTM D792
3 Thickness mm Mitsutoyo 1.0  
4 Thermal conductivity W/m · K - 3.0 ~ 6.0 ASTM D5470
5 Flame retardancy level - Vertical
Burining Test
V-0 UL 94
6 Volume resistance Ω · cm - > 1013 ASTM D257
7 Breakdown voltage kV - > 6 ASTM D149
8 Operating temperature - -40 ~ 180  
9 Surface characteristics - - Self tacky  
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